ELECTRODEPOSITION OF CONIP FILMS

PURPOSE: An electrodeposition of CoNiP films is provided to quantify the magnetic characteristics of the CoNiP layer with the residual magnetic flux. CONSTITUTION: The substrate(110) is arranged in the electroplating bath(115). The electroplating bath comprises the electroplating composition(120). T...

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Main Authors TANG MICHAEL XUEFEI, VENKATASAMY VENKATRAM, TABAKOVIC IBRO, SUN MING
Format Patent
LanguageEnglish
Korean
Published 09.04.2012
Subjects
ADHESIVES
APPARATUS THEREFOR
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
CORRECTING FLUIDS
DYES
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
FILLING PASTES
INKS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
POLISHES
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
USE OF MATERIALS THEREFOR
WOODSTAINS
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Summary:PURPOSE: An electrodeposition of CoNiP films is provided to quantify the magnetic characteristics of the CoNiP layer with the residual magnetic flux. CONSTITUTION: The substrate(110) is arranged in the electroplating bath(115). The electroplating bath comprises the electroplating composition(120). The electroplating composition comprises the nickel source, and the cobalt source, the phosphorus source of at least about 0.1 M. The evaporation current is applied in the substrate. The CoNiP layer having the thickness of 500 nanometers is electro-deposited on the substrate.
Bibliography:Application Number: KR20110099739