SEALED CONTAINER AND SEMICONDUCTOR MANUFACTURING APPARATUS

PURPOSE: A sealed container and a semiconductor manufacturing apparatus are provided to reduce a reactant generated from an atmosphere inside of the sealed container. CONSTITUTION: A FOUP(Front Opening Unified Pod) stores a plurality of wafers(10). The FOUP(20) comprises a front door(20a), a sensor...

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Bibliographic Details
Main Author YAMAZAKI KATSUHIRO
Format Patent
LanguageEnglish
Korean
Published 09.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A sealed container and a semiconductor manufacturing apparatus are provided to reduce a reactant generated from an atmosphere inside of the sealed container. CONSTITUTION: A FOUP(Front Opening Unified Pod) stores a plurality of wafers(10). The FOUP(20) comprises a front door(20a), a sensor part(21), and a transmission apparatus(25) as an external output part. The sensor part includes a temperature sensor, a humidity sensor, and a gas density sensor. An EFEM(Equipment Front End Module) transfers the wafer between the FOUP and an etching apparatus. The EFEM(40) comprises a load port(41) for opening and closing, a transfer robot(42), a purge part(43), and an exhaust part(48) of purge gas.
Bibliography:Application Number: KR20110096503