DEBONDABLE ADHESIVE ARTICLE

An adhesive article is described that is debondable from substrates or adherends with the application of heat.

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Bibliographic Details
Main Authors DETERMAN MICHAEL D, RULE JOSEPH D, LEWANDOWSKI KEVIN M
Format Patent
LanguageEnglish
Korean
Published 26.03.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:An adhesive article is described that is debondable from substrates or adherends with the application of heat.
Bibliography:Application Number: KR20127000788