PRESSURE-SENSITIVE ADHESIVE TAPE

• Main Authors: IKISHIMA SHINSUKE, OOYAMA KOOKI, TORII TADAO, HABU TAKASHI, KATOU YUUKI, ASAI FUMITERU, TAKAHASHI TOMOKAZU, KAMEI KATSUTOSHI
• Format: Patent
• Language: English; Korean
• Published: 26.03.2012
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PURPOSE: An adhesive tape is provided to have excellent thermal resistance by including a thermal resistance layer containing a specific polypropylene based resin, and to be manufactured through low number of processes without using organic solvent. CONSTITUTION: An adhesive tape(100) comprises a heat-resistant layer(10), a base material layer(20), and an adhesive layer(30) in order. The adhesive tape has modulus of elasticity(Young's modulus) of 150mPa or less at 25 °C. The heat-resistant layer comprises polypropylene based resin copolymerized by using a metallocene catalyst. The melting point of the polypropylene based resin is 110-200 °C, the distribution of molecular weight(Mw/Mn) is 3 or less. The adhesive tape additionally comprises a second heat-resistant layer between the base material layer and the adhesive layer. The heat-resistant layer does not contains F^-, Cl^-, Br^-, NO2^-, NO3^-, SO4^2-, Li^+, Na^+, K^+, Mg^2+, Ca^2+ and NH4^+ materially.