WAFER INSPECTION APPARATUS AND METHOD FOR PRE-HEATING PROBE CARD

PURPOSE: A wafer inspection apparatus and a probe card preheating method thereof are provided to reduce installation costs and space of the wafer inspection apparatus. CONSTITUTION: A wafer carrying region(S1) is arranged on the front surface of a device main body in order to transfer a wafer(W) in...

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Bibliographic Details
Main Authors SHIMOYAMA HIROSHI, YAMADA HIROSHI, HOSHINO TAKAAKI, KOJIMA SHINJI, SAIGUSA TAKESHI
Format Patent
LanguageEnglish
Korean
Published 22.03.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PURPOSE: A wafer inspection apparatus and a probe card preheating method thereof are provided to reduce installation costs and space of the wafer inspection apparatus. CONSTITUTION: A wafer carrying region(S1) is arranged on the front surface of a device main body in order to transfer a wafer(W) in cassette unit. A first return region(S2) is arranged in order to return the wafer along the wafer carrying region. An alignment region(S3) is arranged in both end parts of the first return region. A second return region(S4) is arranged in order to return the wafer along the first return region. A wafer inspection region(S5) is formed along the second return region.
Bibliography:Application Number: KR20110092503