LEADFRAME AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: A lead frame and a manufacturing method thereof are provided to control an etching depth by performing a lower etching process after performing a molding process. CONSTITUTION: A plurality of lead parts(100) electrically connects a device chip(120) and an external circuit. An inner lead(122...

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Bibliographic Details
Main Authors PARK, CHUNG SIK, EOM, SAI RAN, LEE, HYUNG EUI, CHUN, HYUN A
Format Patent
LanguageEnglish
Korean
Published 13.03.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A lead frame and a manufacturing method thereof are provided to control an etching depth by performing a lower etching process after performing a molding process. CONSTITUTION: A plurality of lead parts(100) electrically connects a device chip(120) and an external circuit. An inner lead(122) is arranged on a first surface of the lead part. An outer lead(100b) is arranged on a second surface of the lead part. The device chip is connected to the inner lead of the lead part through a wire(126). An etching part(112) insulates neighboring lead parts. An encapsulating material(130) simultaneously seals a lead frame(200) and the device chip.
Bibliography:Application Number: KR20100086159