LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
PURPOSE: A laminate ceramic electronic component and a manufacturing method thereof are provided to improve a dampproof property by enhancing a sealing property or adhesion in an interface between a ceramic part and a Ni-B plating layer. CONSTITUTION: A plurality of internal electrodes(5) are formed...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
12.03.2012
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A laminate ceramic electronic component and a manufacturing method thereof are provided to improve a dampproof property by enhancing a sealing property or adhesion in an interface between a ceramic part and a Ni-B plating layer. CONSTITUTION: A plurality of internal electrodes(5) are formed along a specific interface between ceramic layers. A component body has an exposed terminal which is exposed to a surface of each internal electrode. An external electrode is formed on the surface of a component body to be electrically connected to the exposed terminal of each internal electrode. The external electrode includes a first plating layer(18) and a second plating layer(19). The first plating layer is directly formed on the surface and is comprised of a Ni-B plating layer. The second plating layer is formed on the first plating layer and is comprised of a Ni plating layer without B. |
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Bibliography: | Application Number: KR20110078070 |