LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

• Main Authors: OGAWA MAKOTO, KAYATANI TAKAYUKI, MOTOKI AKIHIRO, SASABAYASHI TAKEHISA, SARUBAN MASAHITO
• Format: Patent
• Language: English; Korean
• Published: 12.03.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PURPOSE: A laminate ceramic electronic component and a manufacturing method thereof are provided to improve a dampproof property by enhancing a sealing property or adhesion in an interface between a ceramic part and a Ni-B plating layer. CONSTITUTION: A plurality of internal electrodes(5) are formed along a specific interface between ceramic layers. A component body has an exposed terminal which is exposed to a surface of each internal electrode. An external electrode is formed on the surface of a component body to be electrically connected to the exposed terminal of each internal electrode. The external electrode includes a first plating layer(18) and a second plating layer(19). The first plating layer is directly formed on the surface and is comprised of a Ni-B plating layer. The second plating layer is formed on the first plating layer and is comprised of a Ni plating layer without B.