HEAT SPREADING PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

PURPOSE: A heat radiation printed circuit board with a high heat discharge effect and a manufacturing method thereof are provided to reduce manufacturing costs by previously laminating a thermal via in a CCL(Copper Clad Laminate). CONSTITUTION: A via hole is formed on a CCL(S100). A thermal via is f...

Full description

Saved in:
Bibliographic Details
Main Authors KIM, YEUNG SEOK, KWON, HYOUK CHON, JEON, HONG JUN, LEE, HAI JOONG, LEE, HYO SOO, KIM, KYUNG HOON
Format Patent
LanguageEnglish
Korean
Published 29.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A heat radiation printed circuit board with a high heat discharge effect and a manufacturing method thereof are provided to reduce manufacturing costs by previously laminating a thermal via in a CCL(Copper Clad Laminate). CONSTITUTION: A via hole is formed on a CCL(S100). A thermal via is formed in a sidewall of the via hole by a via plating process(S110). A pad for mounting an LED module or circuit pattern is formed(S120). A heat sink is additionally formed on the lower side of a printed circuit board(S130). A pattern is attached to the LED module(S140).
Bibliography:Application Number: KR20100081059