LEADFRAME AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: A lead frame and a manufacturing method thereof are provided to improve processing efficiency by forming 2 lead frames at the same time. CONSTITUTION: A semiconductor chip is mounted on the first surface of a die-pad part. A plurality of lead parts(100) electrically interlinks the semicondu...

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Bibliographic Details
Main Authors PARK, CHUNG SIK, EOM, SAI RAN, LEE, HYUNG EUI, CHUN, HYUN A
Format Patent
LanguageEnglish
Korean
Published 27.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A lead frame and a manufacturing method thereof are provided to improve processing efficiency by forming 2 lead frames at the same time. CONSTITUTION: A semiconductor chip is mounted on the first surface of a die-pad part. A plurality of lead parts(100) electrically interlinks the semiconductor chip to an external circuit. A plurality of lead parts is extended from the first surface to a second surface which is opposed to the first surface. A plurality of lead parts is separated each other. An insulating layer(140) is formed on the first surface and insulates between the lead parts and between the lead part and the die-pad part. A supporting part(110) is formed on the second surface and includes insulating materials and insulates between the lead parts.
Bibliography:Application Number: KR20100079536