THERMAL COMPRESS BONDING

PURPOSE: A thermal compression bonding is provided to improve the throughput of a bonding process by simultaneously bonding all workpieces on a substrate carrier. CONSTITUTION: A substrate carrier including workpiece holders(22) is prepared. First workpieces are arranged in the workpiece holders. Se...

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Bibliographic Details
Main Authors LIU CHUNG SHI, JANG BOR PING, LIN WEI HUNG, HUANG KUEI WEI
Format Patent
LanguageEnglish
Korean
Published 21.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A thermal compression bonding is provided to improve the throughput of a bonding process by simultaneously bonding all workpieces on a substrate carrier. CONSTITUTION: A substrate carrier including workpiece holders(22) is prepared. First workpieces are arranged in the workpiece holders. Second workpieces are lifted and arranged to be placed one of the first workpieces. The first and second workpieces are simultaneously bonded by reflowing solder bumps between the first and second workpieces.
Bibliography:Application Number: KR20100135783