Frit sealing system using laser and Frit sealing method using laser

PURPOSE: A frit sealing system which uses a laser is provided to process frit using a homogenized laser beam, thereby improving sealing quality of an organic display apparatus. CONSTITUTION: An internal space partitioned by a first substrate, a second substrate, and frit is sealed by projecting a la...

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Bibliographic Details
Main Authors LEE, JUNG HYUN, JEON, KWANG JIN, CHOI, EI HO, HAM, BYOUNG CHUL, PARK, HONG JIN, LEE, SUN PIL, HAN, JAE BONG
Format Patent
LanguageEnglish
Korean
Published 10.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: A frit sealing system which uses a laser is provided to process frit using a homogenized laser beam, thereby improving sealing quality of an organic display apparatus. CONSTITUTION: An internal space partitioned by a first substrate, a second substrate, and frit is sealed by projecting a laser beam to the frit(30) arranged between the first substrate and the second substrate. A homogenizer(120) is homogenized cross sectional energy distribution of the laser beam generated from a laser oscillation part. An inspection part inspects a state of the frit in which the laser beam is projected. The laser beam projected to the frit is changed when a difference between an inspected frit state and a pre-saved normal frit state exceeds a tolerance range.
Bibliography:Application Number: KR20100074782