MOUNTING APPARATUS
PURPOSE: A mounting apparatus is provided to mount a wafer component of a drawing head in a plurality of mounting heads of a head unit by using a drawing head of a first drawing device and a drawing head of a second drawing device. CONSTITUTION: A conveyor(2) carries in and out a print board(P) in a...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
02.02.2012
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: A mounting apparatus is provided to mount a wafer component of a drawing head in a plurality of mounting heads of a head unit by using a drawing head of a first drawing device and a drawing head of a second drawing device. CONSTITUTION: A conveyor(2) carries in and out a print board(P) in a predetermined mounting work location. A chip component supply part(3) supplies a chip component to the conveyor. A mounting part(4) mounts the chip component on the print board. A wafer sustaining table(5) supports a wafer drawn from a wafer receiving table(170). A drawing device(6) draws out a bare chip from the wafers which are supported by the wafer sustaining table. A camera(8) takes a picture of the bare chip before a drawing operation of the bare chip by the drawing device. |
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Bibliography: | Application Number: KR20110070144 |