MOUNTING APPARATUS

PURPOSE: A mounting apparatus is provided to mount a wafer component of a drawing head in a plurality of mounting heads of a head unit by using a drawing head of a first drawing device and a drawing head of a second drawing device. CONSTITUTION: A conveyor(2) carries in and out a print board(P) in a...

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Bibliographic Details
Main Authors YORO SHINYA, KOBAYASHI KAZUHIRO
Format Patent
LanguageEnglish
Korean
Published 02.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A mounting apparatus is provided to mount a wafer component of a drawing head in a plurality of mounting heads of a head unit by using a drawing head of a first drawing device and a drawing head of a second drawing device. CONSTITUTION: A conveyor(2) carries in and out a print board(P) in a predetermined mounting work location. A chip component supply part(3) supplies a chip component to the conveyor. A mounting part(4) mounts the chip component on the print board. A wafer sustaining table(5) supports a wafer drawn from a wafer receiving table(170). A drawing device(6) draws out a bare chip from the wafers which are supported by the wafer sustaining table. A camera(8) takes a picture of the bare chip before a drawing operation of the bare chip by the drawing device.
Bibliography:Application Number: KR20110070144