EMBEDDED PRINTED CIRCUIT BOARD WITH METAL DAM AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: An embedded printed circuit board which includes a metal dam and a manufacturing method thereof are provided to restrict under-fill bleeding in an active device mounting process, thereby improving junction reliability between an insulating layer and metal layer. CONSTITUTION: An adhesive pa...

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Bibliographic Details
Main Author SHIN, SEUNG YUL
Format Patent
LanguageEnglish
Korean
Published 10.01.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: An embedded printed circuit board which includes a metal dam and a manufacturing method thereof are provided to restrict under-fill bleeding in an active device mounting process, thereby improving junction reliability between an insulating layer and metal layer. CONSTITUTION: An adhesive part(40) is arranged on a circuit pattern layer(100). A metal dam(30) prevents spreading of the adhesive part and a device(60) fixed by the adhesive part. A resin material(50) for controlling self alignment of the device is arranged in a space of the adhesive part among spaces surrounded by the metal dam. The metal dam is arranged into a pair of structures which are facing each other in order to prevent short circuit generation between electrodes in a case of a passive device. The adhesive part is comprised of solder paste or under-fill. The adhesive part prevents spreading of the solder paste in a device mounting process in order to improve reliability between a solder material and circuit pattern layer as a metal pad or the solder paste and electrode of the passive device.
Bibliography:Application Number: KR20100063778