SURFACE MOUNTING TECHNOLOGY SYSTEM AND METHOD OF SURFACE MOUNTING TECHNOLOGY USING THE SAME

PURPOSE: A surface mounting technology(SMT) system and an SMT method using the same are provided to perform a mounting process for a large amount of printed circuit boards at the same time, thereby improving productivity. CONSTITUTION: An inspection device(3) inspects a printing fault state of a pri...

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Bibliographic Details
Main Authors LIM, CHANG SOO, BEACK, HYUN SU
Format Patent
LanguageEnglish
Korean
Published 04.01.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: A surface mounting technology(SMT) system and an SMT method using the same are provided to perform a mounting process for a large amount of printed circuit boards at the same time, thereby improving productivity. CONSTITUTION: An inspection device(3) inspects a printing fault state of a printed circuit board which is printed with device mounting regions and generates an inspection result as a data file. A file converter(4) saves the converted data file by converting the data file. The file converter transmits the converted data file according to an external request. A mounting device(5) requests a data file with respect to the inputted printed circuit board to the file converter. Devices are mounted on the inputted printed circuit board by the mounting device according to the received data file. A code indicator(1) indicates an identification code in each printed circuit board.
Bibliography:Application Number: KR20100061131