BURIED THERMALLY CONDUCTIVE LAYERS FOR HEAT EXTRACTION AND SHIELDING

PURPOSE: A buried thermally conductive layer for extracting and shielding heat is provided to function as an efficient heat spreading machine for extracting heat which is generated during a circuit operation. CONSTITUTION: Buried heat conductive layers(230) are deposited on a layer(210). The buried...

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Bibliographic Details
Main Authors APTE RAJ B, BIEGELSEN DAVID K
Format Patent
LanguageEnglish
Korean
Published 26.12.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A buried thermally conductive layer for extracting and shielding heat is provided to function as an efficient heat spreading machine for extracting heat which is generated during a circuit operation. CONSTITUTION: Buried heat conductive layers(230) are deposited on a layer(210). The buried heat conductive layers are made of materials with high thermal conductivity. At least one vertical via(240) is connected to the buried heat conductive layers. The vertical via connects all buried heat conductive layers each other wherein all buried heat conductive layers are placed in a device. A heat insulating layer(250) is formed on the buried heat conductive layers.
Bibliography:Application Number: KR20110058892