COMPOSITIONS AND METHODS FOR REMOVING ORGANIC SUBSTANCES

Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic...

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Bibliographic Details
Main Authors LEE ZACHARY PHILIP, O'DELL DALE EDWARD, MOORE JOHN CLEAON, MCENTIRE EDWARD ENNS, QUILLEN MICHAEL WAYNE
Format Patent
LanguageEnglish
Korean
Published 23.12.2011
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
APPARATUS SPECIALLY ADAPTED THEREFOR
CANDLES
CHEMISTRY
CINEMATOGRAPHY
DETERGENT COMPOSITIONS
DETERGENTS
ELECTROGRAPHY
FATTY ACIDS THEREFROM
HOLOGRAPHY
MATERIALS THEREFOR
METALLURGY
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:Compositions and methods useful for the removal of organic substances from substrates, for example, electronic device substrates such as microelectronic wafers or flat panel displays, are provided. A method is presented which applies a minimum volume of the composition as a coating to the inorganic substrate whereby sufficient heat is added and immediately rinsed with water to achieve complete removal. These compositions and methods are particularly suitable for removing and completely dissolving photoresists of the positive and negative varieties as well as thermoset polymers from electronic devices.
Bibliography:Application Number: KR20117025376