PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: INOUE KATSUHARU, TAKEBE KAZUO
• Format: Patent
• Language: English; Korean
• Published: 23.12.2011
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; FREQUENCY-CHANGING; HOLOGRAPHY; MATERIALS THEREFOR; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

PURPOSE: A photo-sensitive resin composition, a pattern formed using the same, and a display device including the pattern are provided to include an additional polymeric resin and a polymeric compound. CONSTITUTION: A photo-sensitive resin composition includes a resin, a polymeric compound, a photo-polymerization initiator, a silicon-based surfactant, and a solvent. The resin is an additional polymer containing a structural unit derived from at least one selected from a group including unsaturated carboxylic acid and unsaturated carboxylic acid anhydride and a structural unit derived from a monomer with C2 to C4 cyclic ester and C-C unsaturated double bond. The polymeric compound contains a compound two or more groups represented by chemical formula 1. In the chemical formula, the L1 is ethylene group or propane-1,2-diyl group. The p is the integer of 1 to 20.