STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A stacked package and a manufacturing method thereof are provided to connect a larger number of input/output pads using conductive connection members, thereby reducing the size of the stack package. CONSTITUTION: A first semiconductor package(110) has a first pad(115) and a second pad. A se...

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Bibliographic Details
Main Author HONG, YOUNG SEOK
Format Patent
LanguageEnglish
Korean
Published 14.12.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A stacked package and a manufacturing method thereof are provided to connect a larger number of input/output pads using conductive connection members, thereby reducing the size of the stack package. CONSTITUTION: A first semiconductor package(110) has a first pad(115) and a second pad. A second semiconductor package(120) has a third pad(125) and a fourth pad. A first conductive connection member(130) electrically connects the first pad with the second pad. A second conductive connection member(140) electrically connects the second pad with the fourth pad. An external connection terminal(150) is mounted on the bottom of the first semiconductor package.
Bibliography:Application Number: KR20100053643