SEMICONDUCTOR ELEMENT SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE

• Main Authors: TODA JUNKO, TSUKAMOTO TAKEHITO, MANIWA SUSUMU
• Format: Patent
• Language: English; Korean
• Published: 05.12.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A manufacturing method of a semiconductor element substrate including: forming a first photoresist pattern on a first surface of a metallic plate, to form a semiconductor element mounting part, a semiconductor element electrode connection terminal, a wiring, an outer frame part, and a slit; forming a second photoresist pattern on the second surface of the metallic plate; forming the slit by half etching to connect the metallic chip with a four corners of the outer frame part; forming a plurality of concaved parts on the second surface of the metallic plate; forming a resin layer by injecting a resin to the plurality of concaved parts; and etching the first surface of the metallic plate and forming the semiconductor element electrode connection terminal and the outer frame.