ULTRA LOW POST EXPOSURE BAKE PHOTORESIST MATERIALS
Polymers comprising a first methacrylate monomer having a pendent spacer between the polymer backbone and an acid-liable acetal group, a second methacrylate monomer having a pendent group including a fluorinated alkyl group and a third methacrylate monomer having a pendent hydrocarbon group. Photore...
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
30.11.2011
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Subjects | |
Online Access | Get full text |
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Summary: | Polymers comprising a first methacrylate monomer having a pendent spacer between the polymer backbone and an acid-liable acetal group, a second methacrylate monomer having a pendent group including a fluorinated alkyl group and a third methacrylate monomer having a pendent hydrocarbon group. Photoresist formulations include the polymers, a photoacid generator and a casting solvent. Methods of patterning photoresist films formed from the photoresist formulations are characterized by post-exposure bakes at temperatures of about 60° C. or less. |
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Bibliography: | Application Number: KR20117021466 |