EMBEDDED PCB AND MANUFACTURING METHOD OF THE SAME

PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to perform a junction process of an active device and passive device at the same time by arranging a complex connection pad, thereby improving productivity by simplifying processes. CONSTITUTION: A first metal...

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Bibliographic Details
Main Author SHIN, SEUNG YUL
Format Patent
LanguageEnglish
Korean
Published 17.11.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE: An embedded printed circuit board and a manufacturing method thereof are provided to perform a junction process of an active device and passive device at the same time by arranging a complex connection pad, thereby improving productivity by simplifying processes. CONSTITUTION: A first metal layer(110) is arranged on a carrier(120). The carrier comprises a copper foil layer(121), an adhesive material(122), and a support insulating layer(123). A complex connection pad(130) is arranged on the first metal layer with a carbon nano tube. An electronic device chip is connected to the complex connection pad. An insulating layer embedding the electronic device chip and an outer edge circuit pattern layer including a second metal layer are arranged.
Bibliography:Application Number: KR20100044020