BRIDGE PRINTED CIRCUIT BOARD AND STACKED DIE SEMICONDUCTOR DEVICE USING THE SAME

PURPOSE: A bridge PCB and a stacked die semiconductor device using the same are provided to reduce the thickness of a stack using a bridge PCB for leading a top semiconductor die which is stacked in a low semiconductor die. CONSTITUTION: A groove(113) is formed in a base member(111) to lead a semico...

Full description

Saved in:
Bibliographic Details
Main Authors KIM, JEONG DEOK, KIM, SEONG KEUN, YU, JAE HWANG, NOH, JAE YEON
Format Patent
LanguageEnglish
Korean
Published 14.11.2011
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A bridge PCB and a stacked die semiconductor device using the same are provided to reduce the thickness of a stack using a bridge PCB for leading a top semiconductor die which is stacked in a low semiconductor die. CONSTITUTION: A groove(113) is formed in a base member(111) to lead a semiconductor die. An inner fin(115) is formed in the side of a groove along the edge of the groove. An outer pin(117) is formed in the side or the upper side of the base member a long the edge of the base member. A connection line(119) connects the inner fin and the outer pin. The inner fin, the outer pin, and the connection line are integrally formed.
Bibliography:Application Number: KR20100042365