CHEMICAL MECHANICAL POLISHING SYSTEM WHICH PREVENTS AIR PRESSURE TUBE ELECTRIC WIRES FROM BEING TWISTED

• Main Authors: GOO, JA CHEUL, JEON, CHAN WOON, SEO, KEON SIK, KIM, DONG SOO, BAN, JUN HO, BOO, JAE PHIL
• Format: Patent
• Language: English; Korean
• Published: 07.11.2011
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PURPOSE: A chemical-mechanical polishing system capable of preventing twisting of an air pressure supply pipe which operates a rotary union is provided to successively polish two or more substrates, thereby improving productivity. CONSTITUTION: A polishing plate is installed in order to be able to rotate with a platen pad equipped in the upper surface of the polishing plate. A guide rail is installed along a predetermined route. A substrate carrier unit(120) moves along the guide rail while a target polishing substrate is equipped in the lower part of the substrate carrier unit. The substrate carrier unit includes a rotary union pressurizing the substrate in a lower side during a polishing process. A docking unit(180) is installed in the substrate carrier unit in order to be able to perform docking. The docking unit supplies air pressure in the rotary union which pressurizes the substrate in the lower direction when the substrate carrier unit is placed on the polishing plate.