POLYAMIC ACID AND POLYIMIDE, PROCESSES FOR THE PRODUCTION OF SAME, COMPOSITIONS CONTAINING SAME, AND USES THEREOF
The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by gener...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
06.10.2011
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Subjects | |
Online Access | Get full text |
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Summary: | The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%). |
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Bibliography: | Application Number: KR20117019534 |