MEMS SENSOR PACKAGE

PURPOSE: An MEMS(Micro Electromechanical Systems) sensor package is provided to prevent change of Q value by setting the pressure increase of a sensor body caused by a gas leakage within a predetermined range for the designed service life of the MEMS sensor package. CONSTITUTION: A method for manufa...

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Bibliographic Details
Main Authors BRAMAN TODD L, GLENN MAX C, CURTIS HARLAN L, KARNICK DREW A
Format Patent
LanguageEnglish
Korean
Published 24.08.2011
Subjects
GYROSCOPIC INSTRUMENTS
INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
MEASURING
MEASURING DISTANCES, LEVELS OR BEARINGS
MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION,OR SHOCK
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
NAVIGATION
PERFORMING OPERATIONS
PHOTOGRAMMETRY OR VIDEOGRAMMETRY
PHYSICS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SURVEYING
TESTING
TRANSPORTING
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Summary:PURPOSE: An MEMS(Micro Electromechanical Systems) sensor package is provided to prevent change of Q value by setting the pressure increase of a sensor body caused by a gas leakage within a predetermined range for the designed service life of the MEMS sensor package. CONSTITUTION: A method for manufacturing a MEMS sensor package(10) comprises the steps of: setting a designed service life of a MEMS sensor(12), detecting an allowable deviation of Q value for the designed service life, detecting the predicted leakage speed of the MEMS sensor package, and selecting backfilling gas(14) and the pressure of backfilling gas pressure in order to maintain the Q value within the detected allowable deviation.
Bibliography:Application Number: KR20100122624