STRUCTURE FOR MULTI-ROW LEAD FRAME AND MANUFACTURING METHOD THEREOF

PURPOSE: A structure for multi-row lead frame and a manufacturing method thereof are provided to implement multilayer plating without flash plating and form a circuit through only plating pattern without half-etching of a lead frame source material. CONSTITUTION: In a structure for multi-row lead fr...

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Bibliographic Details
Main Authors EOM, SAI RAN, CHUN, HYUN A
Format Patent
LanguageEnglish
Korean
Published 14.07.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A structure for multi-row lead frame and a manufacturing method thereof are provided to implement multilayer plating without flash plating and form a circuit through only plating pattern without half-etching of a lead frame source material. CONSTITUTION: In a structure for multi-row lead frame and a manufacturing method thereof, a photosensitive material(120) is spread in the lead frame source material(110) to form a first pattern. At least one plating pattern comprised of a Pd, Ni, and Pd layer by using Au as a base layer. The first pattern is used for an I/O or a die pad.
Bibliography:Application Number: KR20110063713