APPARATUS FOR SUBSTRATE EDGE POLISHING

PURPOSE: A section grinding apparatus for a substrate is provided to improve the efficiency of continuous production by controlling the movement of a grinding wheel in a cutting direction and a thrust direction according to the abrasion of the peripheral portion of the grinding wheel. CONSTITUTION:...

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Bibliographic Details
Main Authors OBATA TOMOAKI, OKUWA KOICHI
Format Patent
LanguageEnglish
Korean
Published 14.07.2011
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:PURPOSE: A section grinding apparatus for a substrate is provided to improve the efficiency of continuous production by controlling the movement of a grinding wheel in a cutting direction and a thrust direction according to the abrasion of the peripheral portion of the grinding wheel. CONSTITUTION: A section grinding apparatus for a substrate comprises a grinding wheel(1), a rotational driving unit(30), and a transfer control unit. The peripheral portion of the grinding wheel comprises an elastic material and grinds a section of substrate(2). The rotational driving unit comprises a load current detecting unit and a load current value judging unit. The load current detecting unit detects the load current when the grinding wheel contacts the substrate. The transfer control unit has control units(10,20) for movement of cutting and thrust directions to the section of the substrate. The movement of the grinding wheel in the cutting and thrust directions is controlled based on the load current value judging unit.
Bibliography:Application Number: KR20100001710