SEMICONDUCTOR DEVICE WITH BURIED BITLINE AND METHOD FOR MANUFACTURING THE SAME
PURPOSE: A semiconductor device including a buried bit line and a manufacturing method thereof are provided to stably form a bit line by bonding a second substrate on the rear of a first substrate after the buried bit line is formed on the first substrate. CONSTITUTION: A first substrate(21B) is for...
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| Main Authors | , |
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| Format | Patent |
| Language | English Korean |
| Published |
07.07.2011
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| Subjects | |
| Online Access | Get full text |
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| Abstract | PURPOSE: A semiconductor device including a buried bit line and a manufacturing method thereof are provided to stably form a bit line by bonding a second substrate on the rear of a first substrate after the buried bit line is formed on the first substrate. CONSTITUTION: A first substrate(21B) is formed on a peripheral circuit area(202). An insulation layer(27) is formed on the first substrate. A buried bit line(BL) is buried in the insulation layer. A second substrate(28) is boned with the rear of the insulation layer. The second substrate is adhered to the insulation layer through a bonding(29). |
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| AbstractList | PURPOSE: A semiconductor device including a buried bit line and a manufacturing method thereof are provided to stably form a bit line by bonding a second substrate on the rear of a first substrate after the buried bit line is formed on the first substrate. CONSTITUTION: A first substrate(21B) is formed on a peripheral circuit area(202). An insulation layer(27) is formed on the first substrate. A buried bit line(BL) is buried in the insulation layer. A second substrate(28) is boned with the rear of the insulation layer. The second substrate is adhered to the insulation layer through a bonding(29). |
| Author | LIM, CHANG MOON KOO, SUN YOUNG |
| Author_xml | – fullname: KOO, SUN YOUNG – fullname: LIM, CHANG MOON |
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| Notes | Application Number: KR20090134782 |
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| RelatedCompanies | HYNIX SEMICONDUCTOR INC |
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| Snippet | PURPOSE: A semiconductor device including a buried bit line and a manufacturing method thereof are provided to stably form a bit line by bonding a second... |
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| SubjectTerms | ELECTRICITY |
| Title | SEMICONDUCTOR DEVICE WITH BURIED BITLINE AND METHOD FOR MANUFACTURING THE SAME |
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