STRUCTURE FOR MULTI-ROW LEAD FRAME AND SEMICONDUCTOR PACKAGE THEREOF AND MANUFACTURE METHOD THEREOF

PURPOSE: A structure for multi-row lead frame and a semiconductor package thereof and a manufacture method thereof are provided to simplify a process and manufacturing costs by forming an I/O unit and a die pad through a simple plating. CONSTITUTION: A multi-layer pattern is arranged on a lead frame...

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Bibliographic Details
Main Authors YOO, CHANG WOO, EOM, SAI RAN, LEE, HYUNG EUI
Format Patent
LanguageEnglish
Korean
Published 30.06.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A structure for multi-row lead frame and a semiconductor package thereof and a manufacture method thereof are provided to simplify a process and manufacturing costs by forming an I/O unit and a die pad through a simple plating. CONSTITUTION: A multi-layer pattern is arranged on a lead frame(110). The multi-layer pattern constitutes a first layer(111) as an initial layer. A Pd layer(112) is formed on the top of the first layer. An Ni layer(113) is formed on the top of the Pd layer. An Au layer(115) is formed on the top of the Ni layer.
Bibliography:Application Number: KR20090130665