A COMPOSITION AND SLURRY USEFUL FOR METAL CMP
PURPOSE: A chemical mechanical polishing composition is provided to perform the polishing of a metal layer and a thin film required for the manufacture of a semiconductor at a fast speed, and to ensure excellent long-term storage and activity. CONSTITUTION: A chemical mechanical polishing compositio...
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Main Authors | , , |
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Format | Patent |
Language | English Korean |
Published |
10.06.2011
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Subjects | |
Online Access | Get full text |
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