STACKING QUAD PRE-MOLDED COMPONENTS PACKAGES, SYSTEMS USING THE SAME, AND METHODS OF MAKING THE SAME

Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrical...

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Bibliographic Details
Main Authors QIAN QIUXIAO, LIU YONG, ALLEN HOWARD
Format Patent
LanguageEnglish
Korean
Published 31.05.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Pre-molded component packages that may be as thin as a leadframe for a semiconductor die, systems using the same, and methods of making the same are disclosed. The leads of an exemplary package are exposed at both surfaces at the leadframe. The packages may be stacked upon one another and electrically coupled at the exposed portions of their leads.
Bibliography:Application Number: KR20117008991