APARTUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE BY USING THE SAME

• Main Authors: SHIN, JAE MOO, LEE, JUM DONG, LEE, HWA SEOB, KOH, KWANG DUCK
• Format: Patent
• Language: English; Korean
• Published: 26.05.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: An apparatus for manufacturing a semiconductor package and a method for fabricating semiconductor package by using the same are provided to prevent damage to a wafer by coating a liquid adhesive on a wafer to form a die adhesive layer. CONSTITUTION: In an apparatus for manufacturing a semic...