APARTUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE BY USING THE SAME

PURPOSE: An apparatus for manufacturing a semiconductor package and a method for fabricating semiconductor package by using the same are provided to prevent damage to a wafer by coating a liquid adhesive on a wafer to form a die adhesive layer. CONSTITUTION: In an apparatus for manufacturing a semic...

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Bibliographic Details
Main Authors SHIN, JAE MOO, LEE, JUM DONG, LEE, HWA SEOB, KOH, KWANG DUCK
Format Patent
LanguageEnglish
Korean
Published 26.05.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: An apparatus for manufacturing a semiconductor package and a method for fabricating semiconductor package by using the same are provided to prevent damage to a wafer by coating a liquid adhesive on a wafer to form a die adhesive layer. CONSTITUTION: In an apparatus for manufacturing a semiconductor package and a method for fabricating semiconductor package by using the same, a loading unit(110) supplies a wafer from a semiconductor integrated circuit process to a polishing part(120). The polishing part polishes the front and back sides of the wafer to reduce the thickness of the wafer firstly. The etching part(130) chemically-etches the backside of the ground wafer to reduce the thickness of the wafer. A coating part(150) coats a liquid adhesive on the backside of the chemically-etched wafer to form a die adhesive layer.
Bibliography:Application Number: KR20090112626