TERMINAL STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREOF

• Main Authors: AOKI TOMOYUKI, YAJIMA HIROYUKI, HAMATANI TOSHIJI, ADACHI HIROKI
• Format: Patent
• Language: English; Korean
• Published: 27.04.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PURPOSE: A terminal structure, an electronic device, and a manufacturing method thereof are provided to improve the reliability of the electronic device by easily making a conductor which penetrates through an insulation layer made of prepreg. CONSTITUTION: One or more openings are formed on a prepreg(130). The prepreg is adhered to a substrate with an electronic device(110) so that the conductor comprising a terminal is overlapped with the opening. A conductive paste is formed on the opening region. A part of the conductive paste flows in the opening and is contacted with the conductor. The conductive paste and the prepreg are hardened by a heating process.