COPPER POWDER FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE
A copper powder for a conductive paste contains 0.1 atm%-10 atm% of Si (silicon) and 0.1 atm%-10 atm% of In in the particle. It is preferable that the copper powder for a conductive paste contains 0.1 atm%-10 atm% of Ag (silver) in the particle. It is also preferable that the copper powder for a c...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
21.04.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A copper powder for a conductive paste contains 0.1 atm%-10 atm% of Si (silicon) and 0.1 atm%-10 atm% of In in the particle. It is preferable that the copper powder for a conductive paste contains 0.1 atm%-10 atm% of Ag (silver) in the particle. It is also preferable that the copper powder for a conductive paste contains 0.01 atm%-0.5 atm% of P (phosphorus). The ratio of Si/In (atm ratio) is preferably 0.5-5. The copper powder for a conductive paste is preferably manufactured by an atomization method. |
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Bibliography: | Application Number: KR20107022969 |