MULTILAYER PRINTED WIRING BOARD

The present invention relates to a multilayer printed wiring board having an interlayer insulating layer and a conductor layer formed on a core substrate, the conductor layer being electrically connected through a via hole, characterized in that said core substrate is a multilayer core substrate hav...

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Bibliographic Details
Main Authors SANO KATSUYUKI, INAGAKI YASUSHI
Format Patent
LanguageEnglish
Korean
Published 20.04.2011
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a multilayer printed wiring board having an interlayer insulating layer and a conductor layer formed on a core substrate, the conductor layer being electrically connected through a via hole, characterized in that said core substrate is a multilayer core substrate having conductor layers on the surface of the core substrate and a plurality of conductor layers as inner layers, a thickness of each of the conductor layers as inner layers is larger than a thickness of each of surface conductor layers, and the conductor layer as the inner layer and at least one of the conductor layers on the surface of said core substrate are the conductor layers for a power supply layer or the conductor layers for an earth.
Bibliography:Application Number: KR20117007314