APPARATUS AND METHOD FOR BONDING SUBSTRATE
PURPOSE: An apparatus and method for bonding substrates are provided to suppress the bending of a first substrate and a second substrate due to press difference by forming filling materials in a space between the first substrate and the second substrate. CONSTITUTION: A vacuum chamber comprises a bo...
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Main Authors | , , , , |
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Format | Patent |
Language | English Korean |
Published |
14.04.2011
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE: An apparatus and method for bonding substrates are provided to suppress the bending of a first substrate and a second substrate due to press difference by forming filling materials in a space between the first substrate and the second substrate. CONSTITUTION: A vacuum chamber comprises a bonding space for bonding a first substrate and a second substrate. A first pump(200) inhales the air of the bonding space with the first intensity. A second pump inhales the air of the bonding space with the second intensity. The second intensity is stronger than the first intensity. A nitrogen supply unit supplies nitrogen to the bonding space. A sensor(500) senses the pressure of the bonding space. A controller(600) controls the first pump, the second pump, and the nitrogen supply unit. |
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Bibliography: | Application Number: KR20090095829 |