APPARATUS AND METHOD FOR BONDING SUBSTRATE

PURPOSE: An apparatus and method for bonding substrates are provided to suppress the bending of a first substrate and a second substrate due to press difference by forming filling materials in a space between the first substrate and the second substrate. CONSTITUTION: A vacuum chamber comprises a bo...

Full description

Saved in:
Bibliographic Details
Main Authors JUNG, WON WOONG, ROH, YOUN GOO, PARK, SANG YOUNG, CHA, YOU MIN, MUN, JU EEL
Format Patent
LanguageEnglish
Korean
Published 14.04.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: An apparatus and method for bonding substrates are provided to suppress the bending of a first substrate and a second substrate due to press difference by forming filling materials in a space between the first substrate and the second substrate. CONSTITUTION: A vacuum chamber comprises a bonding space for bonding a first substrate and a second substrate. A first pump(200) inhales the air of the bonding space with the first intensity. A second pump inhales the air of the bonding space with the second intensity. The second intensity is stronger than the first intensity. A nitrogen supply unit supplies nitrogen to the bonding space. A sensor(500) senses the pressure of the bonding space. A controller(600) controls the first pump, the second pump, and the nitrogen supply unit.
Bibliography:Application Number: KR20090095829