PHOTOSENSITIVE RESIN COMPOSITION

• Main Authors: KIM, BYUNG UK, YOUN, HYOC MIN, CHO, TAE PYO, SHIN, HONG DAE, YUN, JOO PYO, WOO, CHANG MIN
• Format: Patent
• Language: English; Korean
• Published: 14.04.2011
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS

PURPOSE: A photosensitive resin composition is provided to improve the remaining rate of the composition or the transmitting rate of ultraviolet ray in addition to the adhesive property, the insulating property, and the flatness property. CONSTITUTION: A negative photosensitive resin composition includes a resin, a urethane resin, a crosslinkable monomer, a photo-polymerizable initiator, and a solvent. The crosslinkable monomer includes at least two ethylene-based double bonds. The resin is selected from an alkaline-soluble acrylate resin, a photo polymer, and the mixture of the same. The alkaline-soluble acrylate resin is the copolymer of monomer with ethylene-based acidic group and monomer without ethylene-based acidic group.