DIAMOND TOOLS FOR GRINDING BRITTLE MATERIALS HAVING HIGH HARDNESS

PURPOSE: A diamond tool for a grinding material of high hardness and high brittleness is provided to prevent the accumulation of residual stress when a wafer collides with a metal bond layer. CONSTITUTION: A diamond tool for a grinding material of high hardness and high brittleness comprises a metal...

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Bibliographic Details
Main Authors CHO, HAN GYOUNG, YUN, JOONG CHEUL, JANG, HONG SEOB, KIM, YOUN CHUL
Format Patent
LanguageEnglish
Korean
Published 13.04.2011
Subjects
BORING
GRINDING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
TURNING
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Summary:PURPOSE: A diamond tool for a grinding material of high hardness and high brittleness is provided to prevent the accumulation of residual stress when a wafer collides with a metal bond layer. CONSTITUTION: A diamond tool for a grinding material of high hardness and high brittleness comprises a metal bond layer, abrasive grains, and filler. The filler is composed of vitreous carbon particles. The vitreous carbon particles have 2.5~3.5GPa hardness and 25~80 GPa modulus. The hardness of the metal bond layer is HRB 76~90 kg/mm, and the transverse rupture strength is HRB 5~20 kg/mm.
Bibliography:Application Number: KR20090119742