METHOD AND APPARATUS FOR ELECTROPLATING SUBSTRATES

PURPOSE: A method and an apparatus for electroplating substrates are provided to increase the speed of coating process by including a unit for generating current pulse and optical pulse. CONSTITUTION: An apparatus for electroplating substrates comprises a coating bath, a transfer unit, a light sourc...

Full description

Saved in:
Bibliographic Details
Main Authors LIPPERT LOTHAR, DAUWE STEFAN
Format Patent
LanguageEnglish
Korean
Published 23.03.2011
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTIONOF COMPOUNDS OR NON-METALS
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A method and an apparatus for electroplating substrates are provided to increase the speed of coating process by including a unit for generating current pulse and optical pulse. CONSTITUTION: An apparatus for electroplating substrates comprises a coating bath, a transfer unit, a light source circuit(60), a cell rectifier circuit(50), and a current and optical pulse generating unit. The coating bath comprises a coating tank filled with coating solution. The transfer unit transfers one or more substrates through the coating bath. The light source circuit comprises one or more light sources(64) for irradiating light onto one or more substrates(1). The cell rectifier circuit comprises an anode(54). The current and optical pulse generating unit generates synchronous current pulses and optical pulses so as to stop the irradiation of one or more light sources during an interval between current pulses.
Bibliography:Application Number: KR20100091668