PHOTOSENSITIVE-POLYIMIDE, ADHESIVE COMPOSITION AND ADHESIVE FILM CONTAINING THE SAME

• Main Authors: SONG, SUN JIN, JEONG, CHUL HO, LYU, YI YEOL, HAN, YONG SEOK
• Format: Patent
• Language: English; Korean
• Published: 23.03.2011
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORIGINALS THEREFOR; PAINTS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PURPOSE: A photo-sensitive polyimide, and an adhesive composition and an adhesive film including the same are provided to obtain the superior thermal stability by including aromatic polyimide backbone and a (meta)acryloyl group. CONSTITUTION: A photo-sensitive polyimide includes an aromatic polyimide backbone and a (meta)acryloyl group. The (meta)acryloyl group is grafted with the backbone. The backbone includes a repeating unit which is represented by one of chemical formula 1a, chemical formula 1a', or chemical formula 1a''. In the chemical formulas, Ar1 is a tetravalent organic group. Y is selected from O, NH, and S. The backbone is additionally includes a repeating unit which is obtained by reacting tetracarboxylic anhydride and diamine. The tetracarboxylic anhydride is represented by chemical formula 2. The diamine is selected from non-substituted aromatic diamine, aliphatic ether diamine, and diaminosiloxane.