CUTTING EQUIPMENT USING LASER

PURPOSE: A laser cutting apparatus is provided to prevent damage to a material by laser beam and crack of the material by rapidly cooling the material heated by laser beam. CONSTITUTION: A laser cutting apparatus comprises a body(100), a laser beam generator(200), and a cooling device(300). The lase...

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Bibliographic Details
Main Authors SHIN, JAE MOO, LEE, JUM DONG, LEE, HWA SEOB, KOH, KWANG DUCK
Format Patent
LanguageEnglish
Korean
Published 23.03.2011
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE: A laser cutting apparatus is provided to prevent damage to a material by laser beam and crack of the material by rapidly cooling the material heated by laser beam. CONSTITUTION: A laser cutting apparatus comprises a body(100), a laser beam generator(200), and a cooling device(300). The laser beam generator comprises a laser beam generating unit and a laser beam irradiating unit and is arranged in the body. The cooling device includes a cooling element, two or more nozzles, and fluid supply pipes. The cooling element is arranged in the body and has through holes which the laser beam irradiated from the laser beam irradiating unit passes through. The nozzles are formed to be declined from the exterior to the interior of the cooling element. The fluid supply pipes provide a fluid to the nozzles.
Bibliography:Application Number: KR20090088038