ROTARY BONDING TOOL WHICH PROVIDES A LARGE BOND FORCE

• Main Authors: NG YIN FUN, WIDDOWSON GARY PETER, HUI HON CHIU
• Format: Patent
• Language: English; Korean
• Published: 09.03.2011
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PURPOSE: A rotary bonding tool is provided to reduce an arrangement error of a bond head by separating a bond force motor from a z-motor and a rotary motor. CONSTITUTION: A bond head(12) includes a collet positioned on one end of a rod shaft. A bond force motor(16) drives the rod shaft along a moving shaft in a direction toward a die bonding position and a direction distant from the die bonding position. A rotary motor(48) rotates the rod shaft around a rotation shaft in parallel to the moving shaft. A coupler combines the rod shaft with the bond force motor and includes a bearing. The bearing makes the rod shaft rotate around the rotation shaft with regard to the bond force motor.