SEALING OF PINHOLES IN ELECTROLESS METAL COATINGS

• Main Authors: GRAY DENNIS MICHAEL, TYSOE STEVEN ALFRED, SORBO FRANCESCO, GIORNI EUGENIO, KOOL LAWRENCE BERNARD
• Format: Patent
• Language: English; Korean
• Published: 08.02.2011
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE: Sealing of the pin hole in an electroless metal coated part is provided to protect a substrate from corrosion due to a fluid communication since a defective part, such as a pin hole or a pit in the electroless metal coated part on a substrate, is filled with hardening epoxy sealant. CONSTITUTION: A sealing method of the pin hole in an electroless metal coated part comprises following steps. A coated product, which comprises an electroless metal coated layer(20) making contact with the surface of a subsrate(10), is prepared. A hardening epoxy sealant layer is applied to the electroless metal coated layer to fill a pin hole. The hardening epoxy sealant is hardened, and thus a hardened epoxy overcoated layer is formed. A substantial part of the hardened epoxy overcoated layer is removed. A product, comprising an electroless metal coated part with slight pin hole, is formed. The pin hole allows the fluid communication between the substrate and an environment.