METHOD OF DESIGNING A PRINTED CIRCUIT BOARD, AND PACKAGE TEST DEVICE HAVING THE PRINTED CIRCUIT BOARD

• Main Authors: JEONG, JAE HOON, KO, CHANG WOO, SONG, KI JAE, SEO, HUN KYO
• Format: Patent
• Language: English; Korean
• Published: 11.01.2011
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INFORMATION STORAGE; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; PRINTED CIRCUITS; STATIC STORES; TESTING

PURPOSE: A method and a package test device thereof are provided to accurately detect an internal defect by accurately measuring signals which are inputted from a test device. CONSTITUTION: A package capacitance, package inductance, and a chip capacitance of a memory device are calculated(S110). A s...