METHOD OF DESIGNING A PRINTED CIRCUIT BOARD, AND PACKAGE TEST DEVICE HAVING THE PRINTED CIRCUIT BOARD

PURPOSE: A method and a package test device thereof are provided to accurately detect an internal defect by accurately measuring signals which are inputted from a test device. CONSTITUTION: A package capacitance, package inductance, and a chip capacitance of a memory device are calculated(S110). A s...

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Bibliographic Details
Main Authors JEONG, JAE HOON, KO, CHANG WOO, SONG, KI JAE, SEO, HUN KYO
Format Patent
LanguageEnglish
Korean
Published 11.01.2011
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
PRINTED CIRCUITS
STATIC STORES
TESTING
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Summary:PURPOSE: A method and a package test device thereof are provided to accurately detect an internal defect by accurately measuring signals which are inputted from a test device. CONSTITUTION: A package capacitance, package inductance, and a chip capacitance of a memory device are calculated(S110). A signal line capacitance and a signal line inductance per unit length are calculated(S120). The length of the signal line is determined based on the package capacitance and the signal line capacitance(S130). A ground line inductance per length unit of the ground line is calculated based on the property of a PCB(S140). The length of the ground line according to a pin is determined based on the package inductance and the ground line inductance(S150). The sum total between stitch capacitance and pad capacitance is determined based on the chip capacitance(S160).
Bibliography:Application Number: KR20090060821