LEAD FRAME DESIGN TO IMPROVE RELIABILITY

• Main Authors: OSENBACH JOHN W, GOLICK LARRY W, STAHLEY MATTHEW E, LOW QWAI HOONG
• Format: Patent
• Language: English; Korean
• Published: 27.12.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE: A lead frame design is provided to improve the reliability in comparison with the existing technique. CONSTITUTION: An electronic device is mounted on the mount part of a lead frame. Wires(830) are welded in a part coated with a metal plating of the lead from landing pads on the electronic...