LEAD FRAME DESIGN TO IMPROVE RELIABILITY

PURPOSE: A lead frame design is provided to improve the reliability in comparison with the existing technique. CONSTITUTION: An electronic device is mounted on the mount part of a lead frame. Wires(830) are welded in a part coated with a metal plating of the lead from landing pads on the electronic...

Full description

Saved in:
Bibliographic Details
Main Authors OSENBACH JOHN W, GOLICK LARRY W, STAHLEY MATTHEW E, LOW QWAI HOONG
Format Patent
LanguageEnglish
Korean
Published 27.12.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PURPOSE: A lead frame design is provided to improve the reliability in comparison with the existing technique. CONSTITUTION: An electronic device is mounted on the mount part of a lead frame. Wires(830) are welded in a part coated with a metal plating of the lead from landing pads on the electronic device. An insulation mold covers the mount part of the lead frame and the electronic device. The mounting unit is separated from the lead.
Bibliography:Application Number: KR20100055837