METHOD OF MANUFACTURIG SEMICONDUCTOR CHIP PACKAGE

PURPOSE: A manufacturing method is provided to be used as an insulator and a support which supports a micro circuit pattern by forming an support part having an insulating material between lead parts. CONSTITUTION: A semiconductor chip(120) is mounted on a die pad part(116) where a lead frame is arr...

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Bibliographic Details
Main Authors PARK, CHUNG SIK, EOM, SAI RAN, LEE, HYUNG EUI, YOON, HYE SUN, CHUN, HYUN A
Format Patent
LanguageEnglish
Korean
Published 07.12.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: A manufacturing method is provided to be used as an insulator and a support which supports a micro circuit pattern by forming an support part having an insulating material between lead parts. CONSTITUTION: A semiconductor chip(120) is mounted on a die pad part(116) where a lead frame is arranged. The semiconductor chip and the lead part(100) of the lead frame are electrically connected to through a wire. The semiconductor chip package is packed to a mold resin, an EMC(Epoxy Mold Compound) by using an encapsulating material(130). The lead frame mounts the semiconductor chip.
Bibliography:Application Number: KR20090046267