NOVEL RESINS AND PHOTORESIST COMPOSITIONS COMPRISING SAME

PURPOSE: A chemically-amplified type positive-tone composition is provided to effectively be imaged by 200 nm irradiation ray, for example, 193 nm irradiation ray. CONSTITUTION: A photoresist compound comprises a resin with the part selected from chemical formula 1-a and 1-b. In chemical formulas, R...

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Bibliographic Details
Main Authors XU CHENG BAI, ZAMPINI ANTHONY
Format Patent
LanguageEnglish
Korean
Published 30.11.2010
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE: A chemically-amplified type positive-tone composition is provided to effectively be imaged by 200 nm irradiation ray, for example, 193 nm irradiation ray. CONSTITUTION: A photoresist compound comprises a resin with the part selected from chemical formula 1-a and 1-b. In chemical formulas, R2 is the same or different non-hydro substituent, and each n is an integer of 0-4. A method for providing a photoresist relief image comprises the steps of: (a) applying the photoresist coating layer on a substrate; and (b) developing a coating layer of the exposed photoresist composition.
Bibliography:Application Number: KR20100047555